BURSA Commentary: Evolution of AI Chips – Malaysia Aims for ‘Advanced Packaging’ Throne

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Malaysia is currently in a critical transition phase from being just a traditional assembly center to a leader in Advanced Packaging. With the surge in the global semiconductor industry expected to reach US$975 billion by 2026, the focus is now shifting to AI chip technology that requires complex integration. This is no longer a matter of ordinary manufacturing, but a matter of the country’s strategic infrastructure.


Supply Chain Value Soar

The government’s move through the National Semiconductor Strategy (NSS) to produce 60,000 skilled engineers will increase the competitiveness of local companies. For investors, this is an early sign of the growth of local OSAT (Outsourced Semiconductor Assembly and Testing) companies. The move to ‘Advanced Packaging’ units means higher profit margins and long-term contracts from global technology giants. Companies involved in IC design and equipment manufacturing automation will receive a large influx of contracts.


Competition and Operating Costs

Despite the wide-open opportunities, the main risk remains for companies that fail to move up the value chain quickly. Growth in traditional segments is expected to level off. In addition, the high electricity requirements for AI data centers increase operating costs. Companies also have to deal with geopolitical uncertainties such as export controls and tariffs that can suddenly disrupt cash flows and global supply chains.


At the micro level, Malaysian semiconductor companies that dare to invest in AI and Advanced Packaging technologies have vast upside potential. However, investors should screen for companies with strong financial fundamentals to cover high R&D costs.


Investor Highlights

Key Catalysts: Implementation of the National Semiconductor Strategy (NSS) and surge in global AI chip demand by 2026.

Key Risks: Lagging and rising energy costs as well as global geopolitical risks.

Trader Focus: Pay attention to technology sector stocks (especially OSAT and equipment) that have direct exposure to AI and data center projects.

Investor Focus: Monitor companies involved in Joint Ventures with global giants (such as Infineon/STMicro) and companies receiving incentives under the New Incentive Framework.

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